Pure Nickel Wire Plating Equipment 1.0mm SUS304 Plate Cover 0.4-0.8Mpa Compressed Air

^{1 Overview:
With the wide application of hard and brittle materials, in the processing of single crystal silicon, sapphire, quartz and other materials, especially in the process of silicon slicing, the multi-line cutting method of consolidated abrasive grains is gradually adopted. Our company is the diamond electroplating line equipment that meets the requirements of the current cutting method and is widely used in the field of hard and brittle material cutting. Its main features are environmental protection, high efficiency and low energy consumption.}

^{2. Process flow:
Feeding→1 ultrasonic cleaning→2 washing→3 washing→4 washing→5 washing→6 preplating→7 sanding→8 thickening→9 washing→10 hot water rinsing→11 hot air drying→cutting}

^{3, equipment technical parameters
3-1 equipment working mode: one machine six lines work at the same time
3-2 production beat: not less than 15 meters per minute;
3-3 Equipment footprint (L*W*H): 30M*2.5M*3M (approximately ±5% of the actual production).}

^{4, equipment work requirements
4-1 power supply: 380V±10%/50Hz, three-phase four-wire; power distribution requirements: less than 100KW
4-2 Pure water: Outlet water resistivity: ≥15MΩ.cm, pure water needs to be externally matched.
4-3 Inlet pipe diameter: 1′′; total drain pipe diameter: ≥2′′
4-4 compressed air: 0.4-0.8Mpa}

^{5. Working environment requirements:}

• Air temperature: 0~35°C
• ^{Relative humidity : ≤80%}
• ^{Factory level: clean factory (actual)}